PCB上游原物料供需缺口擴大 PI第二波漲勢將再起
Date: 2018-04-17
News Type:
聚酰亞胺薄膜(PI)在3月底又傳台灣供貨商達邁發出調漲價格通知,且已有部分FCCL客戶端同意此調漲動作,並準備將在產品價格進行半年來第二次的反應,預期將引起另一波軟板成本價格的走揚。
其實,PI價格走揚與另一 PCB重要原物料銅箔價格目前處高檔震蕩的道理類似,都在於新需求瓜分供給造成市場供需失調。
PI主要供應軟性印刷電路板(FPC)上游基材軟性銅箔基板(FCCL),市場幾乎是寡占,主要供貨商僅有美國杜邦(DuPont)、日本鐘淵化學(Kanaka)、韓國SKC Kolon PI及台灣達邁4家,全球PI廠近年並無明顯擴大產能,加上PI燒結的石墨片,可廣泛應用在散熱上,因此在PI產能移轉至燒結散熱用石墨片趨勢影響下,自然對FCCL廠供應就更加吃緊。
雖然,部分FCCL廠在目前第2季軟板市場需求淡季中,對PI價格喊漲不表認同,但在市場供需失調狀況一直存在,且在需求不斷成長下,即使PI的漲價在現階段被暫時壓下,但馬上進入第3季的市場旺季,屆時,各廠也不得不接受價格調漲。
同樣道理,銅箔價格目前處高檔震盪,國際銅價遲遲不見價格明顯回調跡象,主要也是因電動車產業蓬勃發展,進一步帶動電動車用電池對銅箔的高度需求,推升銅箔價格居高不下,而國際銅價也被PCB 業者引用為其產業景氣重要指標。 (數據源:鉅亨網)
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