N.T.I.: 2018年mSAP為影響PCB產業的關鍵議題
Date: 2018-03-31
News Type:
N.T.I.中原捷雄博士於CPCA Show2018開幕論壇中分享2017年全球PCB整體概況。 2017年帶動PCB成長主因為智能型手機及車用電子的應用，全球PCB產值達626.21億美元，年成長率達8.1%，且預計今年的成長模式也是如此。另一方面多數的軟板都被用於行動裝置，這些電路板大多將用於蘋果智慧手機，筆電和智慧穿戴。東南亞去年的PCB成長率則十分可觀，成長率平均達兩位數以上，尤其以泰國與越南為最；美國PCB廠因軟硬結合板訂單及出貨量增加而成長4.5%，皆可直接歸功於蘋果貢獻。台商臻鼎科技2017年以35.75億美元，首度登上全球第一的寶位，年成長率更高達32%。
展望2018年，因應iphone 8及iphoneX而採用mSAP(半加成法)高階製程， mSAP製作方案主要是針對減成法製作困境、與加成法精細線路製作的既存問題進行改良。 mSAP的製程較為艱鉅，這種類載板HDI，機台需要達到L/S = 10/15μm的高線寬解析度的規格要求，而且mSAP製程的成本高。同時，隨著需求增加及越來越多的競爭者投入這個產業，mSAP等高階PCB製程會在接下來幾年之中成為智能型手機的主流，會隨著製程的成熟，良率的提升，而逐漸擴大市場的佔有率，此製程技術將成為今年全球PCB擴廠投資的重點項目。 (新聞來源: TPCA)
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