手機記憶體零組件供應吃緊
Date: 2013-04-18
News Type:
目前多項手機用記憶體零元件都出現供給吃緊的現象，包括Mobile RAM、NAND Flash、eMMC/eMCP等，主要是記憶體產能排擠效應導致。其中各大記憶體廠已將旗下產能轉進Mobile RAM上，但市場仍是吃緊，間接導致eMCP供貨不足。eMCP是由NAND Flash晶片、Mobile RAM晶片、控制晶片組成，相較eMMC多了Mobile RAM晶片。（來源：PCB資訊網）
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