雙通合體台半導體業當心
Date: 2017-11-09
News Type:
博通正式向高通發出收購要約，業界人士分析，「雙通」合併將打造IC設計業的巨無霸，將使全球半導體業排名重新洗牌之際，使得高通在手機芯片相關資源更充沛，最主要的競爭對手聯發科壓力更大；同時，儘管博通與高通原本就都是台積電主要客戶，一旦「雙通」合併，也會提高對供應鏈的議價權，值得關注。
目前全球IC設計業排名第3和第4的輝達與聯發科，全年營收規模約在80億美元附近。以高通和博通目前的營運規模來看，雙強合併，營收規模肯定超過350億美元，將輝達和聯發科狠甩在後。
若以內含製造業的全球半導體廠來看，「雙通」合併後，營收規模應會擠下台積電，進入全球第三大半導體廠之位。
至於「雙通」合併若成局，首當其衝受影響的便是高通最大勁敵聯發科；同時也將提高未來新公司對供應鏈的議價權，例如兩者現在佔台積電營收規模超過兩成，一旦合併，將會超過目前的第一大客戶蘋果，訂單流向對台積電營運的影響力倍增。 (新聞來源:經濟日報)
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