港臺企在南京建12億美元半導體項目
Date: 2013-04-11
News Type:
由臺灣立升與香港企業共建的半導體專案已簽約落戶南京，項目計畫總投資達12億美元。該項目引進海內外數名業內技術專家，打造化合物半導體研發、封裝、測試、產學研、孵化及全球化合物半導體技術交流基地。專案一期建設砷化鎵、氮化鎵類化合物半導體產品研發、封裝、測試、產學研及公司運營總部。專案二期計畫從事氮化鎵、碳化矽類半導體外延片、晶片的研發、生產與銷售。（來源：新華網）
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