景碩客戶帶動需求 近2季趨旺季水準
Date: 2013-04-11
News Type:
景碩掌上型裝置使用晶片尺寸覆晶載板全球占一席之地，在用戶端聯發科、高通兩大晶片廠在大陸競爭搶市，帶動FC-CSP載板需求持續走高，景碩表示，近兩年顯示Q2都已趨於旺季水準，目前掌握訂單也不錯，包括基地台、手機、記憶體及消費性電子等產品接單都優於首季。景碩Q2營收季增率約一成，毛利率、獲利再提高。（經濟日報）
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