日月光 高通 攜手前進巴西設廠
Date: 2017-03-31
News Type:
Qualcomm攜手日月光在巴西設立中美南洲首座半導體封測廠。日月光、高通及巴西政府於3月8日簽署不具法律約束力的備忘錄，各方將對相關內容及本公司具體投資金額等事宜進行討論，並擬于達成共識後簽署正式合。初期擬共同合資2億美元（約新臺幣62億元）在巴西Sao Paulo設廠。相關人士指出，日月光及高通合資的巴西廠，將會主攻高階的手機晶片封測、手機及物聯網的系統級封裝（SiP）等領域，若一切順利進行，預估2018年就可開始營運。
由於巴西人口超過2億，是全球人口數排名第5大國，也是南美洲人口最多的國家，加上4G智慧手機的需求正在高速起飛，由於巴西政府祭出許多補助及租稅上的優惠吸引國際大廠前往設廠，也造就高通及日月光決定攜手赴巴西設廠的契機。(新聞來源:TechNews)
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