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Industrial Technology Research Institute Established SIG with the PCB Industry to Facilitate the High Value of the Industry

 

Date: 2017-03-28

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To control the next generation’s demand for the technical development of PCB, Taiwan Printed Circuit Association (TPCA) and Industrial Technology Research Institute (ITRI) organized the Seminar on Development of Six PCB Key Technologies in TPCA on March 21, 2017. The seminar aimed to establish the Special Interesting Group (SIG), formulate the goals of development and modes of cooperation, and facilitate the high value and upgrade of the industry through the cooperation between ITRI and the PCB industry. The seminar attracted 90 representatives from PCB manufacturers, raw material suppliers, equipment manufacturers, government agencies and corporations to discuss the future technical development of PCB. 

Since 2016, TPCA has examined technology gaps in PCB with the full support of ITRI. After integrating its capacity, ITRI proposed six PCB key technologies, including 5um LDI and Laser Treatment Process and Equipment Automation, proposed by Leader of Laser Center Chang Fang, High Frequency Testing Technology, proposed by Leader of Electronic and Optoelectronic System Research Laboratories Wang, Pei-Hua, 10~100GHz High Frequency Material Development, proposed by Deputy Leader of Material and Chemical Research Laboratories Chiu, Kuo-Chan, <10um Laminate-designed R2R Smart Manufacturing System and FPC Material Development, proposed by Manager of Electronic and Optoelectronic System Research Laboratories Yan, Hsi-Husan, 3-6 Oz Copper Clad and High Frequency Material Lamination Equipment and Laminate-related Material Technology, proposed by Leader of Mechanical and Mechatronics Systems Research Laboratories Chou, Ta-Hsin, and Integrated-panel Fan-out Technology, proposed by Leader of Electronic and Optoelectronic System Research Laboratories Lo, Wei-Chung.

In addition to proposing key technologies, ITRI also had six groups to discuss with PCB industry how to put the industry into effect and problems faced by the industry. Each group established the SIG according to the situation to have a regular discussion on technical cooperation, application for government resources, and equipment localization. By doing so, the seminar hoped to bridge the industry and the academic institution and corporations, reduce information gap, and facilitate the high-value research and development of the industry and its competitiveness. (Source: TPCA)

 

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