【行業亮點】金居Q1獲利再往上；銅箔今年仍小幅供不應求
Date: 2017-02-07
News Type:
銅箔廠商金居2016年表現亮眼，以產品比重來看，上季厚銅:薄銅產品比重為4:6，今年估維持此比重。厚銅主要的客戶為銅箔基板廠商、薄銅客戶為PCB廠商。以近期營運來說，目前仍為滿載，1月加工費再微幅調漲，2月估持平，過年期間仍是加班趕工，整體第一季毛利率、獲利仍可望較去年第四季佳。金居是自去年第二季起產業逐季回升，去年全年加工費漲幅約3成，展望今年度，今年銅箔估仍是小幅供不應求，但吃緊狀況會較去年和緩，估全年加工費漲幅約個位數。
值得注意的是，今年的銅箔產業是否可以維持健康的產業供需，潛藏風險仍是看中國新能源車補貼是否變動，將會影響中國銅箔業者是否將產能回轉到印刷電路板用銅箔，估政策3月出臺。
但另一方面，今年的銅箔需求仍有汽車電子以及伺服器產業的支援，尤其是汽車電子，以相對過去傳統汽車一台車估需用0.5米平方的銅箔基板，未來汽車電子用量提升下，一台車需要用到的銅箔基板約可達2米平方的水準。而在新產品部分，主要是高頻高速以及LOW PROFILE產品，後者主要要求為低粗糙度、也可以做到高頻高速，目前小量出貨中。(新聞來源：MoneyDJ新聞)
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