日本CMK將量產車用焊接裂紋抑制電路板
Date: 2016-01-27
News Type:
日本CMK公司在“第8屆汽車電子技術展”上，展出了具有抑制焊接裂紋功能的車用有機樹脂電路板“SEPT”。設想用於發動機直載、致動器一體用途，以及為減輕汽車重量和降低成本而代替陶瓷電路板。該公司表示，已基本確定從2016年底開始量產。
日本CMK的“SEPT（Stress Easing PWB Technology）”系列電路板。在電路板表層採用柔軟材料，以緩解部件與基板間的應力，從而防止裂紋。“SEPT”的抗焊接裂紋性與陶瓷電路板相當，但表層以外的材料與普通的有機樹脂電路板（FR-4）相同，因此成本比陶瓷電路板要低。(新聞來源：及展訊)
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