蘋果任意層3雄 明年齊擴產
Date: 2015-12-09
News Type:
蘋果明年iPhone 6c、iPhone 7及新產品持續推出，台系3家任意層高密度連接板廠華通電腦、燿華電子、欣興電子除不看淡本季傳統淡季，也看好明年齊步擴增產能，透明度優於大多數同業，也看好Any Layer將有更多手持、穿戴式裝置及物聯網產品採用，率先絕大多數上市櫃印刷電路板（PCB）廠曝光明年擴產計畫，欣興更一舉擴增40％到月產能70萬平方呎。燿華指出，Any Layer及更進階的細線路市場前景，除宜蘭A棟、B棟陸續裝機並在明年1月起投產，第2季將動土興建C棟、2017年底前完工，C棟規模將是宜蘭廠區最大。華通強調，轉投資大陸重慶廠前兩期陸續宣告滿載，3期明年首季裝機，將提前在第2季投產，將再添高階HDI月產能15萬平方呎，迎接第3季傳統旺季來臨。(新聞來源：工商時報)
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