群翊工業遷往新廠 將提供更優質的環境與服務
Date: 2015-11-18
News Type:
群翊總經理李榮坤表示，公司專注於塗佈、乾燥、曝光的研發，從PCB、FPC、BGA產業開始扎根，一路延伸至光電領域，但市場變化極為快速，因此群翊的研發腳步從來不會停頓，唯有持續向前才能搶得先機。台灣新廠佔地6000坪，並配備500 坪千級標準無塵室，擁有從研發、設計、加工、組裝、測試等一貫化、現代化的全製程生產條件，除可整廠輸出外，也能針對客戶需求「量身訂做」，產能橫跨PCB、光電產業所需的各式相關製程設備。
李榮坤指出，在特定領域建立代表性的商品是群翊拓展市場的重要推動力，能為產業的加速升級和蓬勃發展注入新的活力。目前群翊在技術門檻高的BGA、Flip Chip研發已達90%以上，且在FPC領域已拉近與日本進口設備的距離，除內銷市場穩定外，外銷市場中的韓國、日本、印度、泰國也都成為主要的市場。
新廠地址
桃園市楊梅區和平路188號
電話:03-4853536.4851536
傳真:03-4856336
歡迎各位先進蒞臨指導
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