蘋果拉抬欣興 Q4產能滿載
Date: 2015-11-04
News Type:
PCB廠商欣興受惠蘋果新機拉貨，加上覆晶載板（FC-BGA）新廠8月起出貨放量，第3季順利由虧轉盈。欣興財務長沈再生表示，第3季營收明顯成長，主要來自拿下更多HDI訂單，展望第4季，大客戶手機需求續旺，HDI板出貨將再攀升，HDI稼動率持續滿載，達90-95%左右。
值得注意的是，欣興近兩年大力投入下一世代IC載板新廠出貨量終於放大，沈再生指出，新廠出貨量從8月開始放量，第4季出貨續揚，可望有效收斂虧損，明年上半年客戶也將針對新品拉貨，淡季相對不淡。(新聞來源：自由時報)
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