安徽省最大的積體電路項目合肥破土動工
Date: 2015-10-21
News Type:
大陸國務院於2014年6月印發《國家積體電路產業發展推進綱要》，將積體電路產業上升到國家戰略層面重點發展。近日，總投資135.3億元人民幣的合肥晶合晶圓製造專案(一期)正式破土動工，該項目是安徽省目前最大的積體電路項目產業。
據瞭解，該專案由全球知名的晶圓製造企業——臺灣力晶科技股份有限公司與合肥方合資建設的晶圓製造專案，選址于新站區內的合肥綜合保稅區，占地約300畝，專案計畫2017年10月份投產，達產後可月產4萬片12寸晶圓。初期產品主要用於生產LCD(液晶)面板驅動IC(晶片)，未來將導入其他高端IC製造業務。 (新聞來源：中新網)
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