蘋果與英特爾新品上市 高階HDI需求升
Date: 2015-09-16
News Type:
蘋果iPhone 6s兩款新機亮相後，將從9月12日開放預購，另外，英特爾以新一代Skylake處理器架構，在Ultrabook與主機板推動新一輪薄型化需求。業界觀察，二者共通點皆是仰賴高階HDI技術，也是3C電子產品走向輕薄短小的關鍵推手。法人預期，三大任意層HDI廠華通、欣興及燿華為主要受惠廠商，同時臻鼎、健鼎也因坐擁先進HDI產能有望沾光。
華通既有HDI產能供給蘋果已吃緊，重慶涪陵廠HDI的新產能於第3季逐步開出，正逢其時，同時期燿華也於宜蘭廠開出高階HDI產能，因應客戶需求，隨新產能順利開出，單季有機會力拚轉盈。
欣興在HDI產能滿載之際，大園新廠的新產能預定於10月開出，有望加快整體營運自谷底爬升速度。法人預期，該廠高階HDI產能全開的單月貢獻約2億元新台幣。(新聞來源： 經濟日報)
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