清華控股擬投入300億元人民幣研發手機晶片 挑戰高通
Date: 2015-08-20
News Type:
隨著大陸試圖降低對國外工業技術的依賴，國產手機晶片也變的刻不容緩。據《中國日報》日前報導，清華控股計畫在未來數年內投資至少300億元人民幣(約合47.4億美元)開發手機晶片技術，挑戰市場領頭羊高通的主導地位。
清華控股表示，與國際競爭對手相比，大陸仍然在技術上落後3到5年，尤其是尖端的4G和5G產品。
據悉，清華控股做為大陸科技行業的先鋒企業，其公司旗下的清華紫光正在與美光科技展開談判，希望斥資230億美元對收購這家美國存儲晶片製造商。(新聞來源：中國日報)
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