高端HDI在穿戴電子和汽車電子業的帶動下供不應求
Date: 2015-08-06
News Type:
據資料統計，在產業佈局上目前有45%左右的PCB產能出自大陸，產品類型以標準多層板為主，且迅速朝高端HDI、高密度互連板、柔性電路板等產品線擴展。總體來看，柔性電路板和高密度互連板(HDI)是近兩年PCB市場增長的兩大看點。一方面，在現今各大品牌搶攻可穿戴電子市場的風潮下，為柔性電路板廠商帶來了不小的商機；另一方面，隨著汽車電子化程度的不斷提升，車用柔性電路板的用量也呈現出上升的勢頭。而在4G通信移動終端替換效應的推動下，一批高端HDI板主力廠商紛紛積極擴充產能，以滿足快速攀升的市場需求。
隨著當前高端智慧型手機占整體手機市場的比重逐步增長，近年來智慧型手機設計轉入採用任意層HDI板。由於在投資金額高、良率相對不易掌控等因素，目前全球具備大量供給任意層HDI板能力的廠商僅有北歐NCAB集團、日本Ibiden、奧地利奧特斯AT&S、韓廠Semco與LG Innotek、臺灣欣興、華通與燿華等廠商。現今蘋果憑藉大屏iPhone 6及iPhone 6 Plus在去年贏回全球市場，以及在今年初發佈的Apple Watch與改版的Macbook Air，手機與平板電腦螢幕尺寸的不斷放大，促使市場對於HDI板需求大增，供貨更顯吃緊。(新聞來源：PCB網城)
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