PCB制程升級 牧德三月出貨攀升
Date: 2013-03-14
News Type:
牧德看好精密度更高的積體電路(IC)基板制程，產生相關自動檢測(AOI)設備需求，在去年第4季及今年第1季已占營收五成，帶動今年營收逐季攀升。牧德指出，看好IC基板領域的晶片尺寸(CSP)覆晶(Flip Chip)載板，線上寬需求縮到傳統制程三分之二，外觀檢測需求抬頭，3月出貨可望比2月攀升。（來源：經濟日報）
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