蘋果擴增日系PCB供應鏈
Date: 2015-06-03
News Type:
蘋果(Apple)iPhone 6系列熱銷，相關供應鏈亦受惠，然蘋果為分散風險並維持獲利，持續擴增供應商家數，以取得議價優勢，近期業界傳出2大日系PCB廠釋出搶單壓力，爭取更低接單報價，台系PCB廠面對日廠競爭，後續恐被迫降價承接蘋果新機訂單，使得利潤空間受限。不過，相關PCB業者對此均不予置評。
供應鏈業者指出，以iPhone 6系列任意層高密度連接板(Any Layer HDI)訂單為例，供應商包括日本Ibiden、奧地利AT&S、美國TTM，以及台廠欣興、華通，而隨著Ibiden產能恢復，積極爭取蘋果訂單，台廠首當其衝，面臨Ibiden競價壓力，欣興、華通為力守訂單，勢必會降價因應，下一代iPhone新機訂單比重與利潤空間恐將縮減；至於台系軟板廠臻鼎、台郡亦傳出遭到蘋果調整iPhone 6系列訂單比重，不僅台廠彼此競爭激烈，更加入日系大廠Nippon Mektron進行競價搶單。
蘋果為維持獲利空間，勢必全面壓縮新機生產成本，對於台系PCB廠而言，儘管生產良率已提高，但面對降價搶單壓力，未來獲利恐難有突出表現。(新聞來源：財訊新聞 )
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