丹邦科技PI膜募投專案即將達產
Date: 2015-04-28
News Type:
早在2013年丹邦科技公佈增發預案，擬通過定向增發募資6億元人民幣，投入“微電子級高性能聚醯亞胺(PI)研發與產業化”項目。
目前公司表示，PI膜專案主體工程建設已基本完成。該募投項目預計年中達產，年底將釋放100%產能。
據悉，PI膜是FPC（柔性電路板）的上游材料，更是FPC產線中高毛利與高技術壁壘的環節所在。(新聞來源：百能網)
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