穿戴式裝置競賽鳴槍 PCB供應鏈搶單大備戰
Date: 2015-03-19
News Type:
隨著蘋果智慧手錶Apple Watch即將開賣,PCB業者預期將全面擴大穿戴式裝置應用領域,為PCB供應鏈營運注入新活水,近期全球PCB業者紛加速拉升技術研發與產能設備實力,為搶食新一波穿戴式裝置等物聯網商機全面備戰。
PCB業者表示,PCB產業已相當成熟,產品包含硬板(R-PCB)、高密度連接板(HDI)、軟板(FPC)及IC載板,過去廣泛應用於PC、平板電腦、手機及各類消費性電子產品,然近年來PC、移動裝置等消費性產品需求增長動能不再強勁,且迅速進入低價競爭,影響上游PCB供應鏈發展,使得PCB產值已難見顯著增長。
PCB業者指出,近年來雖然不少大廠全面發展智慧穿戴式裝置等物聯網相關應用,但市場需求遲未見引爆,包括Google催生的Google glass,以及三星電子(Samsung Electronics)等廠商推出的智慧手環、智慧手錶等裝置,均未能帶動整體市場起飛,然隨著Apple Watch現身,可望為穿戴式裝置應用帶來起飛契機。
近期台系PCB業者包括臻鼎、華通、耀華、金像電、健鼎、瀚宇博等,紛因應客戶需求,決定擴充產能或精進制程,2015年資本支出大幅拉升。另外,韓廠大德電子為搶攻物聯網與智慧穿戴式裝置訂單,亦決定打造適合多樣少量生產的專用生產線,而日系與大陸PCB業者也都積極規劃擴充產能。(新聞來源:Digitimes)
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