方正擬並購軟硬結合板廠
Date: 2015-01-15
News Type:
方正科技未來擬進一步加大PCB市占比重,可能以並購方式涉及軟硬結合電路板領域,為進軍穿戴電子產品市場鋪路。方正科技現有業務包括PC個人電腦、印刷電路板以及系統集成等,隨著全球PC市場需求下滑,方正調整策略為「由PC業務向IT服務業務轉型」。方正科技PCB產品主要為 HDI(高密度互連)、多層板和系統板背板,近兩年PCB業務營收比重上升,就2014年上半年來看,該板塊營收占比達到49.04%。
方正看好軟硬結合板產品的應用領域,可覆蓋FPC(軟性電路板)於PCB的應用領域,又可應用於可穿戴電子設備,未來不排除以並購方式進入軟硬結合電路板業務領域,以彌補現該市場技術門檻,同時開啟穿戴電子產品市場大門。
方正在2015年將更加關注物聯網解決方案、智能交通、資訊安全(平安城市)、醫療資訊化這四個垂直業務方向,並加強這幾方面的業務擴展和投資並購。此外,“國產化”也將作為公司重點發展方向,在既有產品之上,進一步完善具有自主知識產權的產品體系。(新聞來源:新華網)
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