晶片客戶加持 景碩上半年營運不看淡
Date: 2013-02-21
News Type:
睽違年余，景碩科技元月營收在高通、聯發科等兩大晶片廠訂單加持帶動下，元月營收再創歷史新高。景碩產品兼具印刷電路板的傳統PCB及積體電路(IC)載板，尤其掌上型裝置大量運用的晶片尺寸(CSP)覆晶(Flip Chip)載板更是全球重要供應商，隨著用戶端的高通及聯發科兩大晶片廠在大陸競爭搶市，帶動景碩FC-CSP載板首季淡季不淡，下半年更將明顯發酵；IC載板方面，景碩也持續看好後續發展，特別是蘋果去「三星化」下單台積電的加持。整體來說，景碩對於首季可望淡季不淡，預測與去年第4季歷史新高季減幅不到二位數；第二季傳統「五窮六絕」也不看淡，預估營收及毛利率都會優於首季。(來源：經濟日報)
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