樂思化學推出EnFILL新制程
Date: 2014-12-03
News Type:
樂思化學成功推出EnFILL®填孔鍍銅制程。特殊的配方設計提高了HDI任意層(Any-layer)的構建能力，各集成系統均可使用高電流密度，生產週期縮短了40%，填孔性能卓越可靠，酒窩小。
樂思化學PCB金屬化全球產品經理譚智偉先生說：“EnFILL填孔鍍銅制程可以滿足人們日益增長的電子產品向高精小型複雜化發展的需求。該制程適用於垂直連續電鍍線(VCP)，超填和半填(部分填孔)的工藝選擇提高了制程的生產能力和可靠性，操作簡單，鍍液維護方便。”
為滿足智慧手機和平板電腦等高端電子產品的市場需求，填孔電鍍(CVF)在PCB酸銅電鍍中的應用出現了顯著增長，成功製造這些電子產品就需要滿足每個原始設備製造商(OEM)指定的日益複雜的HDI設計要求。應對挑戰，“任意層”的設計已被廣泛採用，以減少PCB層數和增加電路密度，從而允許更多的自由設計電路。(新聞來源：TPCA整理)
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