金安國紀臨安專案一期投產
Date: 2014-11-06
News Type:
近日，金安國紀發佈公告稱，年產1020萬張中高等級覆銅板和出售半固化片600萬米專案的廠房建設已基本竣工完成，一期專案的生產設備安裝調試已經完成，開始進入投產階段。
隨著一期專案的順利投產，將有利於金安國紀自身發展，增加其覆銅板產品的多樣性，擴大中高等級覆銅板產品的市場份額，進一步強化公司的競爭優勢。據介紹，專案分兩期進行，第一期進行“月產50萬張覆銅板和50萬米出售半固化片”生產線建設，第一期專案投產後，公司將擇機進行第二期 “月產35萬張覆銅板”生產線的建設。
覆銅板是電子工業的基礎材料，主要用於加工製造印製電路板(PCB)，廣泛用在電視機、收音機、電腦、電腦、移動通訊等電子產品。受益於大陸4G和汽車電子等市場需求的推動，PCB相關的上下游企業在今年表現良好。（新聞來源：中證網）
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