PCB高階設備2015年樂觀展望
Date: 2014-10-30
News Type:
日、韓、兩岸PCB產業積極搶進發展高階細線路、輕薄化製程，並且因板子高度輕薄，線路走入細緻化，自動化、捲對捲(roll to roll)生產設備、無接觸式成像、光學檢測等設備趨勢更加明顯。設備業者指出，從目前客戶的訂單情況來看，2015年全球高階PCB生產設備的需求將較2014年再成長，特別是高階HDI、IC載板與軟板的擴產將會持續。
台灣IC載板大廠欣興、景碩均已興建高階IC載板新廠，欣興已自2014年第3季起小量試產，景碩則預定於2015年開始量產，兩家大廠均投入高達新台幣百億元資金進行新產能建置，並且隨著晶圓代工龍頭台積電可望續接蘋果下一世代新處理器代工訂單，欣興及景碩將隨之間接受惠。景碩不僅擴充新廠，2014年內清華廠也持續增加設備，擴充約20%產能。由於IC載板走向20奈米以下製程世代，自動化、線距縮小使製程難度不斷提升，高階設備廠之間競逐技術與產能，也帶來高階設備2015年樂觀展望。
值得注意的是，大陸政府積極投資半導體產業，IC載板也是其發展一環，據悉有多家國營PCB大廠力圖跨足發展IC載板，深南電路、康遠相當積極，據悉，深南可能直接從CSP載板開始試產。此外，HDI大廠華通重慶廠目前僅開出第一期產能，2015年將視客戶需求與市場供需情形規劃下一階段產能。（新聞來源：DIGITIMES）
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