安博電路多層印刷電路板專案2016年一期完成
Date: 2014-08-27
News Type:
今年4月，安博電路板有限公司投資銅陵經濟技術開發區pcb產業園專案，目前正在進行樁基施工。據介紹，該項目總投資為5.5億元人民幣，其中固定資產投資為4.7369億元人民幣，占地面積5萬多平方米，建築面積超過6.2萬平方米，主要建設1棟三層的主廠房（含辦公樓），1棟倒班樓，1棟多功能樓，1棟fpc（柔性線路板）研發大樓及固廢處理中心等，建成後達到年產200萬平方米印刷電路板的生產規模。其中，普通印刷電路板80萬平方米，高密度互連印刷電路板（hdi）108萬平方米，柔性線路板（fpc）12萬平方米。
其中專案一期預計從2014年4月持續到2016年3月，第二期則將從2016年4月持續到2018年3月。且該專案主要生產高密度多層印刷電路板，產品符合《產業結構調整指導目錄》鼓勵類第二十八大項第21款新型電子元器件（高密度印刷電路板和柔性線路板等）製造，為大陸重點支援的高新技術領域產品。 (新聞來源：銅陵日報)
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