中京電子：募投PCB專案部分開始試運營
Date: 2014-08-07
News Type:
中京電子近日公告：其投資達3.88億元人民幣的募投專案已於8月2日實現部分工藝試運行，該專案已處於試運營階段。公司2011年招股書中表示，該專案預計達產後淨利潤為1.1億元人民幣。
據悉，該專案為新型PCB產業建設專案，研發、生產和銷售1-2階高密度互連（HDI）印製電路板、單雙面高導熱金屬基（鋁基）印製電路板和6層及以上多層印製電路板，年新增產能36萬平方米，其中HDI板14.4萬平方米、鋁基板3.6萬平方米、多層板18萬平方米。中京電子錶示該募投專案達產後將實現年銷售收入5.59億元人民幣、利潤總額1.3億元人民幣、淨利潤1.1億元人民幣，5.2年就能收回專案投資。（新聞來源:上海證券報）
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