中芯國際與美國高通公司合作推進大陸28納米晶圓製造
Date: 2014-07-09
News Type:
大陸規模最大、技術最先進的積體電路晶圓代工企業 -- 中芯國際積體電路製造有限公司與美國高通公司共同宣佈,中芯國際將與美國高通公司的子公司 -- 美國高通技術公司(Qualcomm Technologies, Inc.)在28納米工藝制程和晶圓製造服務方面緊密合作。該合作將會提升中芯國際28納米制程的成熟度及產能,也使其成為大陸本土率先為美國高通技術公司部分最新的驍龍處理器提供28納米多晶矽 (PolySiON) 和28納米高介電常數金屬閘極 (HKMG) 工藝制程產品的半導體代工企業之一,且這對中芯國際28納米工藝制程的完善以及競爭力的提升具有重要的里程碑意義。(來源:上海電子網)
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