下半年萬機齊發,景碩營收創新高
Date: 2014-07-09
News Type:
在蘋果開始積極替iPhone 6備料下,手機晶片及ARM應用處理器的晶片尺寸覆晶基板(FCCSP)第2季下旬已經供給吃緊,7月以來則傳出缺貨消息,IC基板廠景碩因新產能開出受惠最大。下半年進行智慧型手機銷售旺季,除了蘋果iPhone 6開始擴大零元件備貨,中低價智慧型手機更是呈現「萬機齊發」榮景。由於不論是高階或中低價智慧型手機,均採用28奈米以下先進制程的手機晶片或ARM應用處理器,因此推升FCCSP基板強勁需求,景碩因擁有最大FCCSP基板產能,成為最大受惠者。蘋果近期開始擴大iPhone 6零元件拉貨,雖然景碩目前仍不是A8應用處理器FCCSP基板供應商,但是iPhone 6採用的高通4G手機晶片、新帝iNAND Flash、Skyworks及Avago的功率放大器(PA)、博通WiFi無線晶片系統封裝(SiP)模組等,相關IC基板均由景碩供貨。此外,大陸下半年擴大對4G LTE智慧型手機補貼,中低價4G智慧型手機將放量出貨,內建的高通、聯發科、邁威爾(Marvell)4G多頻多模手機晶片,或輝達(NVIDIA)ARM應用處理器等,也是採用景碩FCCSP基板。(來源:工商時報)
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