華天科技：5.26億人民幣投建積體電路封裝項目
Date: 2014-07-02
News Type:
華天科技6月27日晚間公告，公司全資子公司華天科技（西安）有限公司將投資5.26億元人民幣，進行“FC+WB積體電路封裝產業化項目”的建設。據悉，該項目是在西安公司已掌握的FC+WB積體電路封裝測試工藝技術的基礎上，引進國際先進的積體電路封裝測試設備、儀器805台（套），購置國內配套儀器、設備337台（套），建成一條具有國際先進水準的FC+WB積體電路封裝測試生產線。項目建設期3年，項目建設採用分步分期的方式進行建設。專案完成後，年新增系列積體電路先進封裝測試能力2億塊。(來源：證券時報網)
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