穿戴市場新服務，宜特切入軟板焊點檢測
Date: 2014-06-18
News Type:
穿戴式應用成為全球科技業的新寵，為了協助業者在穿戴產品設計所面臨的可靠度問題，宜特科技宣佈，切入穿戴式軟板焊點檢測服務，提供IC設計與軟板業者，確保穿戴式產品在晶片組裝的品質良率。宜特科技可靠度工程處長 曾劭鈞表示，穿戴式產品有兩個特點，一是在裝置內可放置元件空間有限、二是穿戴式產品除了必須選擇軟板外，其板子上的電路寬度更需縮小，藉此滿足更細小的焊點需求，並且縮小軟板在穿戴產品內所占的面積，符合消費者對穿戴產品輕薄短小的需求。而軟板中，組件焊點將會因軟板的可撓曲性而承受更大幅度的外力，如何提高穿戴式產品的可靠度，是許多業者共同努力的目標。宜特和客戶共同合作設計，利用可靠度測試手法來驗證穿戴式產品焊點強度。板階可靠度(Board Level Reliability )是國際上常用來驗證焊點強度的實驗手法，常見的實驗項目：落下測試、溫度迴圈測試、彎曲測試等等。使用Daisy chain IC（菊輪鍊）搭配軟式印刷電路板，並配合即時阻抗監控系統，可有效得知IC在軟板上的焊點壽命。 (來源：宜特科技)
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