興森科技上海新陽聯手投建半導體矽片專案
Date: 2014-05-28
News Type:
興森科技、上海新陽（5月22日晚間披露了投建300毫米半導體矽片專案的情況。根據公告，5月21日，興森科技、上海新陽、上海新傲科技股份有限公司及張汝京簽署《大矽片專案合作投資協定》。根據協定，各方擬設立“上海芯森半導體科技有限公司”承擔300毫米半導體矽片專案。據悉，300毫米半導體矽片是大陸半導體產業鏈上缺失的一環，長期以來一直依賴進口。實際上，此次投建300毫米半導體矽片專案是興森科技投建積體電路封裝載板項目後，在積體電路產業方面再次佈局。興森科技4月28日與華進半導體封裝先導技術研發中心有限公司全體股東簽署增資協定，興森科技以貨幣形式出資2,000萬元，占比9.94%。成為華進半導體公司主要股東之一標誌著興森科技的封裝載板技術方面的積累已經使得興森科技被業內認可為該領域的國內領軍企業之一。(來源：中證網)
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