國際銅價攀高點，金居6月擬漲2%
Date: 2014-05-28
News Type:
國際銅價過去一個月基期走高，在成本墊高，金居開發銅箔22日表示，6月銅箔報價擬上漲約2%。對於電子業傳統「五窮六絕」，金居認為下游印刷電路板（PCB）2014年景氣明顯轉旺，並不明顯看淡，5月、6月營收均與4月差不多。銅箔產業售價是根據倫敦金屬交易所（LME）每月20日前一個月週期的平均價格，再加上代工費，最近銅價上漲，尤其上週期銅更攀上11周高點，金居認為報價有機會調漲。金居指出，3月受國際銅價走跌衝擊，用戶端銅箔基板（CCL）、印刷電路板（PCB）廠當月拉貨觀望，導致營收明顯低於預期，需求及遞延的訂單反映在4月，當月出貨1,200噸銅箔，遠遠高於3月的800噸。金居強調，市場普遍認為2014年PCB景氣優於去年，公司2013年失火的二廠三分之一盎司（OZ）薄型銅箔生產線100%恢復，月底並試產新產品氧化銅粉，爭食高密度連接（HDI）電鍍制程商機，2013年同遭失火波及應用軟性印刷電路板（FPC）的生產線，則在第3季裝機投產。(來源：經濟日報)
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