興森科技擬2,000萬參股華進半導體公司
Date: 2014-05-08
News Type:
4月28日晚間，興森科技公告，公司於4月28日與華進半導體封裝先導技術研發中心有限公司全體股東中國科學院微電子研究所、長電科技、通富微電、華天科技、深南電路有限公司、晶方科技、安捷利電子科技（蘇州）有限公司及江蘇中科物聯網科技創業投資有限公司簽署了《關於對“華進半導體封裝先導技術研發中心有限公司”的增資協議》，公司擬以自有資金，以貨幣形式出資2,000萬元，持股1,600萬股，占比9.94%。興森科技表示，成為華進半導體公司主要股東之一標誌著公司的封裝載板技術方面的積累已經使得我司被業內認可為該領域的國內領軍企業之一。據悉，華進半導體公司的主要股東是國內領先的封裝測試企業長電科技，華天科技，和通富微電等，通過投資進入華進半導體公司能夠提供一個公司與國內領先的封裝測試企業之間良好的互動平臺，通過技術研發和市場拓展等方面的合作，大幅加快公司封裝載板業務規模化的進程，符合公司戰略發展的要求。(來源：證券時報網)
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