品牌廠全力佈局，台廠高階HDI供貨緊
Date: 2014-05-08
News Type:
近期品牌大廠三星電子、宏達電、Sony、華碩、宏碁等紛將推出新款智慧型手機，加上大陸品牌廠亦全力佈局高階智慧型手機市場，帶動半導體供應鏈包括晶圓代工、封測及PCB廠產能利用率同步升溫，由於智慧型手機功能趨於多樣化，採用高階HDI設計已蔚為風潮，使得HDI大廠欣興、華通及耀華等訂單動能大增。台系HDI大廠欣興、華通及耀華第2季產能利用率急升溫，尤其欣興HDI產能更從首季低於70%躍升至80~90%，且因高階多層HDI制程繁雜，供貨已出現吃緊，客戶甚至開始預搶產能，業者預期高階HDI供貨吃緊情況可能延續至2014年底。另外，韓系HDI廠DAP日前傳出工廠火災、產能減少，目前韓廠在高階HDI產能約有30%供應缺口，可能使得台廠接單進一步增長，加上2014年下半又有大客戶蘋果(Apple)新款iPhone準備上市，業界傳出新款iPhone可能推出2款機種衝量，屆時高階HDI供貨不足問題恐將擴大。(來源：電子時報)
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