大陸今年積體電路規模將超三千億元人民幣
Date: 2014-03-26
News Type:
科技部曹健林副部長在“極大型積體電路製造裝備及成套工藝”專項2014年工作務虛會上指出，專項自實施以來，大陸已經在積體電路高端裝備、成套工藝、關鍵材料、封裝測試等領域取得了部分突破。除了上述製造工藝突破，光刻機整機集成及零部件技術水準也得到迅速提升，封測產業加速升級，專項成果輻射相關產業應用。據大陸半導體行業協會預計，2014年國內積體電路產業銷售額增幅將達到20%，規模將超過3,000億元人民幣。(來源：慧聰網)
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