任意層高密度連接板，三大廠擴產以待旺季
Date: 2014-03-05
News Type:
智慧型手機大廠紛採用任意層高密度連接板，華通、耀華及欣興三大廠均認為，下半年傳統旺季將會有數月供不應求。欣興佈局未來市場的需求，去年資本支出104億元，已達歷史高峰，今年暫估約在100億元，但主力都放在近兩年積極擴充的積體電路（IC）基板，占今年的85%，僅15%用在印刷電路板（PCB）。欣興表示，球閘陣列（BGA）覆晶（Flip Cpip）載板新廠可望下半年逐漸貢獻營收，Any Layer預計第3季大幅成長。欣興去年資本支出有25%至28%用在高密度連接（HDI）和傳統PCB，但因與蘋果關係疏遠，產能利用率不如預期，今年重返供應鏈，將明顯貢獻營運。耀華指出，Any Layer下半年需求可期，但近年用戶端急單趨勢明顯，建構制程資金又龐大，仍以保守原則，但資本支出仍會較去年成長許多。耀華去年資本支出15億元，今年雖尚未定案，估將超過20億元。為迎接下半年傳統旺季，將自第2季、第3季持續擴增產能〈以上為新臺幣〉。(來源：經濟日報)
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