華芯半導體正式進軍晶圓級封裝產業
Date: 2014-02-27
News Type:
近日，山東華芯半導體有限公司、濟南市高新區管委會、臺灣群成科技股份有限公司共同對外宣佈，三方將共同致力於WLP-晶圓級封裝產業創新與發展。據悉，華芯WLP專案總規劃10億美元，目標是在2020年發展成為世界先進水準的積體電路先進封裝測試產業基地。其中，項目一期總投資1.5億美元，通過群成科技提供先進完整的WLP工藝技術授權，建設完整的封裝測試生產線和各類研發創新設施，為各類IC產品提供具有高性價比的先進封裝測試服務。項目各項前期準備工作已經大規模展開，計畫於2014年6月份設備搬入，9月份試產。(來源：IC設計與製造)
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