合肥近百億積體電路產業項目集中簽約
Date: 2014-01-16
News Type:
本月13日，合肥市積體電路產業項目在政務區進行集中簽約。據悉，本次集中簽約的積體電路產業項目共14個，總投資82.78億元人民幣。其中，設計類項目10個。主要是展訊通信合肥研發基地專案、聯發科技合肥研發基地及汽車電子晶片專案、兆易積體電路產品設計研發基地專案等；製造封裝類專案3個。主要是為傑獅隆電子八寸晶圓及汽車半導體元器件封裝項目、國晶微電子封裝項目等；產業基金類專案1個，即中興合創積體電路產業基金。隨著這一批項目的建成投產，將大大提升合肥市相關產業積體電路元器件當地語系化配套水準，力爭把合肥建設成為大陸積體電路產業聚集區。(來源：合肥網)
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