聯茂返台 未來兩年投資45億新臺幣
Date: 2013-01-10
News Type:
全球第五大銅箔基板(CCL)廠聯茂電子決定回台擴大投資設廠，預計未來兩年內共將斥資新臺幣45億元，將涵蓋土地、廠房、設備等相關營運用途。由於大陸生產成本逐年升高，以及臺灣現有的平鎮廠產能滿載，因此加碼設置銅箔基板和軟性銅箔基板(FCCL)產線，未來當新產能完工後，聯茂臺灣的銅箔基板月產能規模至少倍增，聯茂是繼钜橡之後首家決定回台投資之台系印刷電路板廠。(來源：電子時報)
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