Vertical Panel / Pattern Plating

Model: Cupracid HLC, Cupracid AC, InPro A200, InPro 300

Booth No: TBA

Characteristic

Cupracid AC The process development was based on Atotech's extensive experience with high current density conveyorized plating systems. Specially designed for use in vertical conveyorized equipment at high current densities with soluble copper anodes Cupracid AC has excellent throwing power for high productivity Compatible with conveyorized equipment using force flood agitation The electrolyte has a low surface tension electrolyte to ensure wetting of fine structures Plated copper deposits are ductile and fully bright bright Conformal Plating with InPro A200 The InPro A200 process gives excellent throwing power especially with BMV's at high current density operation at up to 3.5 A/dm2 Ideally suited for high productivity in panel or pattern plate mode. Plated copper reliability meets all industry standards Optimal line shape in pattern plate application Simple process control for continuous high volume production Stable in operation and no harmful breakdown products are produced ensuring best process reliability BMV Filling with InPro A300 InPro A300 is designed for blind micro via (BMV) filling at high current densities up to 2.5 A/dm2. Gives reliable BMV filling with varying diameter and depth BMV's on the same panel Optimal BMV filling is achieved with relatively low surface copper plating Compatible with panel and pattern plating

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Vertical Panel / Pattern Plating

Characteristic

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