Super Thin Copper Foil for IC substrate

Model: Super Thin Copper Foil for IC substrate

Booth No: TBA

Characteristic

Super Thin copper foil with carrier is mainly used for IC Substrate which are formed by MSAP process. *Super Thin Copper Foil for IC substrate is 3um copper which covered with 18um copper foil. It is extremely easy to peel off once apply. *Suitable for mSAP semi-additive process, can be used as thin circuit substrate application. *The metal releasing layer + 3um electroforming copper is generated by physical production procedure on 18um copper foil substrate. *Suitable for IC Substrate, high-density interconnect technology boards, IC package process materials, etc.