Ultrasonic Cutting System for Cross-Section Observation
Model: Polish Cut System CSX-100 lab
Category: Others
Exhibitor: TechTrend Science Co., Ltd.
Booth No: TBA
Characteristic
Polish cut for hard-to-cut materials such as SiC, Ceramics(LTCC) or composite materials Long-life blade The Cutting blade extends 10mm Easy alignment to cutting line Easy fixing of workpieces using cutting tape CSX-100 is suitable for small scale production as well
Other Products
-
Roll to Roll Dry Film Laminator
-
Stencil Laser Equipment
-
日本 SANSO PMD-421 耐酸鹼泵浦
-
Desmear
-
STAMPING MACHINE
-
AIR MAX SHOE SOLE SUCTION MAT
-
Automatic Milling Bit Ring Loading Machine
-
Microscope
-
Conditioner 850H
-
Permanent hole plugging ink
Products you may be interested in