Magnetic drive seal-less pump

REINFORCED PLATE BOARD LAMINATING MACHINE

Clean oven (40~200℃)

Mitsubishi Laser Drilling

SINGLE-COMPONENT SOLDER STRIPPER

Multilayer Inductive Bonding

IC Substrate(PBGA/CSP/FCCSP)-Sputer coating

SLITTING & SHEETER

Hitachi X-ray thickness gauge

Heatsink Paste