LPKF Through-Glass Vias with Laser Precisions
Model: LPKF Vitrion 5000
Category: Routing Machine
Exhibitor: MICROSYS ENGINEERING CO., LTD.
Booth No: TBA
Characteristic
‧ Glass as interposer ‧ Efficient ultrafast laser process ‧ Up to 5 000 holes per second ‧ Standard production wafers
Other Products
-
Horizontal Plating M/C
-
GLASS CUTTING
-
Flatting Machine
-
automatic vacuum packaging machine
-
PCB Dimension Distributed Measurement Machine
-
Thermomechanical Analyzer
-
Automatic Hot Air Conveyor Oven(Rack type)
-
Nylon Bristle Brush
-
日本 SANSO PDH-E054IT10-T DC直流 耐酸鹼泵浦
-
Tool of V-cut
Products you may be interested in