美四大 CSP 財報週,零組件多空交戰
Date: 2024-01-30
News Type:
本週微軟、Google、亞馬遜、Meta 四大重量級 CSP(雲端服務供應商)都將公布上季財報,市場聚焦資料中心業務、資本支出與 AI 相關布局進度,也牽動伺服器供應鏈後續展望;伺服器關鍵零組件機殼、導軌受惠AI伺服器貢獻提升,去年下半年營運漸入佳境,市場看好 AI 伺服器帶動產品設計變更、複雜度與規格升級,加上負重要求提高,對於機殼、導軌是正向趨勢,不過今年上半年伺服器產業仍面臨通用型產品需求回溫緩慢,以及 CSP 處於轉換到自研晶片的過渡期,由於零組件營運很大程度還是倚賴規模,市場短期頗有多空交戰的味道。
伺服器機殼、導軌廠如勤誠、川湖、迎廣、晟銘電、南俊國際等去年下半年營收都較上半年回溫,尤其大廠勤誠、川湖在AI產品貢獻度提升下,去年Q4季增幅都較同業突出。
生成式AI帶動AI投資熱潮,而輝達AI晶片供不應求,也讓高階AI伺服器身價水漲船高,包括散熱、機殼、導軌都被點名可望受惠AI伺服器趨勢。
高階AI伺服器因高U數設計、以及規模升級,對於機殼、導軌而言,ASP將有大幅度提升,而隨著今年AI伺服器出貨逐步放量,也有助於提升機殼、導軌AI伺服器營收貢獻度。
對於零組件廠而言,營收來自P(價格)乘以Q(數量)的組合,規模還是必須觀察的重點,而AI伺服器對於整體伺服器需求量的貢獻、以及未來AI伺服器架構發展方向,產業與市場仍有不少辯論存在,零組件業者指出,未來要界定一般伺服器與AI伺服器其實越來越困難,排除掉高階採用輝達晶片的AI伺服器,以及CSP大廠所採用的ASIC,其實越來越多廠商開始運用通用型伺服器架構去改,而且隨著AI應用、情境越來越多元,高、中、低階需求也都慢慢浮現,加上伺服器本來就沒有標準品,大廠也都有自己的規格,很難從單一產品或規格去界定整個產業的發展趨勢。
那麼要怎麼去看零組件成長機會呢?其實還是要看這些零組件廠是否能持續與上游晶片、終端伺服器大廠保持緊密合作,以及不斷贏得新規格開發案、建立護城河。(新聞來源: MoneyDJ)
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