Over the past six months, ITRI has teamed up with LED driver IC manufacturer Macroblock, PCB manufacturer Unimicron, and semiconductor manufacturer PlayNitride to jointly develop the next-generation Micro LED application technology, which made its debut at COMPUTEX 2018 in Taipei on June 5^th to display the cooperative R&D results. This is the world’s first Micro LED display module to be directly transferred to PCB substrate.
 

       The passive matrix-driven “ultra-fine pitch Micro LED display module” jointly developed by ITRI and three other manufacturers has succeeded in directly transferring the micro LED array wafer to the PCB substrate. Doing so has achieved the previously planned specifications - an LED grain size of about 50 µm ~ 100 µm, a pitch of less than 800 µm, a module size of 6 cm x 6 cm, resolution of 80 x 80 pixels, and the ability to be freely joined and applied to video walls and indoor signage.

 

       Although the ultra-fine pitch Micro LED display module can already be made in a colored version, it is still not available in ‘R’GB full color design since the red LED is restricted by its own characteristics. Coupled with a certain degree of roughness of traditional PCBs, the color tends to be affected by transferring. This issue also highlights the difficulty of directly transferring the Micro LED to the PCB substrate. Since the uniformity is not easy to control, certain technical obstacles still need to be meticulously overcome.
 

       Currently, the ultra-fine pitch Micro LED display technology and application developed by the quartet cooperation of ITRI, Macroblock, Unimicron, and PlayNitride has shown preliminary results in the exhibition. Due to continuous technological advancements, it is believed that further improvements will be made in the near future. (News source: TechNews)