In 2019, the demand for mid- and high-end PCB processes will be driven by the following three new kinetic factors: an increase in the number of optical-related lenses, the design of wireless communication and power battery modules, and the upgrading of new specifications for automobile electronics. These factors will help Taiwanese companies, including Compeq, Zhen Ding Tech, Flexium Interconnect, Unitech, etc., to benefit and strive for greater market penetration due to market optimism.

 

According to industry analysts, automobile electronics is an area that will be actively and continuously deployed by large manufacturers in 2019 for terminal applications. Tripod Technology has benefited from the higher demand for automobile electronics, high-value Netcom, and other products to increase gross profit margins, and its focus on the automobile electronics market share in 2019 will continue to improve. Zhen Ding Tech and Flexium Interconnect, flexible PCB manufacturers, are also actively developing automobile communication and automobile networking applications to improve their sales performance.

 

Despite the recent unpleasant market outlook on smart phones, the industry is not pessimistic. Market experts believe that the sales volumes of both new and old iPhone models will continue to increase steadily. Huawei’s shipments are expected to exceed 200 million units, while global mobile phone shipments will reach 1.2 billion units to help related suppliers operate soundly next year.

 

Regarding upgraded smart phone specifications, first-line PCB manufacturers are optimistic about the different fields. Zhen Ding Tech and Compeq are looking forward to an increase in the number of optical-related mobile phone lenses, optical anti-shock, and other functions as standard smart phone accessories, which will help drive a greater demand for the production of high-end modular PCBs.

 

The flexible PCB manufacturer Flexium Interconnect also feels hopeful about the development of next-generation communication applications, such as wireless communication modularization. The major flexible PCB manufacturers are expected to have a new role of integrators to incorporate the antenna design from the module end. Flexium Interconnect already achieved initial results in 2018 in the two new applications of new communication management modules and high-frequency transmission modules. (News source: Economic Daily News)