Taiwanese CCL manufacturers vigorously advance into substrate material Increasing the next wave of growth momentum
發佈日期:2022-02-16
新聞類型:
Among PCB upstream, high-end, substrate, HDI, high-frequency, and high-speed materials are considered the largest markets for future growth. Of these, substrate material is believed to demonstrate the strongest growth momentum. Hence, Taiwanese CCL manufacturers have been vigorously aiming for a cut in this. As they enter via the BT substrate material market and develop products using various methods, they hope to seize business opportunities from a market currently monopolized by Japanese companies.
According to statistics, shipment volumes of BT substrate materials in 2020 have reached about 21.8 million m2, of which Japanese suppliers (MGC, Showa Denko, Panasonic, Sumitomo Bakelite) account for nearly 80%. The volume of overall shipment of ABF substrate material has reached about 16.7 million m2, of which Ajinomoto seized 96% of the market share alone. Based on this, it is clear that Japanese manufacturers are leading in high-end substrate materials.
According to players of the trade, BT and FR4 substrate material can be jointly shared in some machines, making capital expenditures lower. However, the process and control parameters can be complicated and precise. Compared to the developments of ABF substrate material by Taiwanese manufacturers, it would be necessary for them to invest in brand-new equipment and establish process capabilities. Besides this, it is difficult for competitors to step into the market within the next 3 years given the current monopoly of ABF substrate materials. Therefore, there is a relative chance of success for Taiwanese manufacturers to penetrate the BT substrate materials market.
Taiwanese CCL manufacturers include ITEQ, EMC, and NPC as they have begun to invest in research and development. In October 2020, ITEQ announced that it would establish a joint venture with Japan’s MGC to develop substrate materials for non-BT resin systems. EMC has started mass production of SiP module substrate products in 2020 and is expected to mass produce AiP and FC- BGA substrate products in 2022. NPC has already launched an ultra-low thermal expansion and low dielectric substrate materials to penetrate the market.
更多最新消息
- TPCA Show 2025 參展報名! 2024-11-15
- TPCA Show 10/25 展覽如期舉行 2024-10-24
- TPCA Show 2024 預先登錄 2024-10-23
- Rajah&Tann:Doing Business in Thailand &Southeast Asia 2024-10-18
- 比亞迪泰國工廠竣工,並達成第800輛新能源車的生產目標 2024-07-25
- 陸再取消ECFA逾百產品關稅減讓 2024-07-10
- AI、能源轉型引爆!美銀:2026銅上看12000美元 2024-06-30
- MKS-阿托科技 大中華區業務總監 蔡政修博士對於大中華PCB市場的展望問與答 2024-06-06
- 戴爾發表 AI PC,拚2025年成標配 2024-05-20
- 台積電先進封裝大躍進 矽光子封裝2025上陣 2024-05-10
- 電子製造產業前進泰國 TPCA攜手台灣各大公協會建構人才及完整供應鏈 2024-05-09
- PCB企業重整自救!廣州泰華公開招募投資人! 2024-03-05
- 兩岸PCB供應鏈齊聚泰國 2026全球產值比重可望超過5% 2024-03-05
- 2024泰國電子智慧製造系列展 經濟部助臺灣PCB產業赴泰打造韌性供應鏈 2024-03-05
- 景碩考慮在馬來西亞設立 IC載板廠 2024-02-15
- SAPKS昆山喬遷開幕典禮 2024-02-02
- 中國大陸改寫全球電動車版圖 2024-02-01
- 調查:2023年全球半導體營收下滑8.8% 這一家逆勢暴衝 2024-01-30
- 美四大 CSP 財報週,零組件多空交戰 2024-01-30
- CES下周登場 開啟AI PC元年 2024-01-15